Material outline


The choice of seal material will depend on the material being processed and the operating conditions. The table below is a general guidance on seal material selection. If any doubt please contact our sales office.

EPDM:

Resistance is good to alcohol, ketones, mineral acids and alkalis. Especially suitable for CIP. Not suitable for use with oils and hydrocarbons. Temperature range from -50°C to 150°C.
FPM: Particularly resistant to acids, solvents and most commonly used chemicals in the food industry. Unsuitable for ketones, esters, hot concentrated caustic solutions, and steam. Temperature range from -30°C to 200°C.
NBR: Resistance is good to oils, mineral fats and water. Not recommended for CIP. Temperature range -40°C to 100°C.
VMQ: High chemical resistance to most media encountered in the food industry. Good resistance to oxidising agents, alkali solutions, and animal/vegetable fats. Not recommended for strong acids and bases. Temperature range from -60°C to 200°C.
PTFE: Almost universal chemical inertness. Suffers from cold flow and hence must not be over tightened. Temperature range from -100°C to 250°C.
KALREZ: Almost universal chemical inertness. Especially suitable for CIP, SIP and WFI systems. Temperature range -20°C to 260°C.
ENVELOPE: Almost universal chemical inertness. This gasket is a composite construction being a PTFE outer case, in contact with the media, and a FPM filler that provides elasticity. Temperature range from -30°C to 200°C.


WARNING: Limits of application stated herein are standard values. They could be individually transgressed with due consideration to respective service conditions. In the event of a large duty cycle, pulsating operation and other complex operational conditions, simutaneous transgression of these values is not recommended. Due to a large variety of service conditions that may arise in course of actual use, the company does not take responsibility of or guarantee the functional accuracy of the individual components. Rights for changes are reserved.